歡迎光臨中圖網(wǎng) 請(qǐng) | 注冊(cè)

集成電路封裝材料的表征

出版社：哈爾濱工業(yè)大學(xué)出版社出版時(shí)間：2014-01-01
開本： 16開 頁數(shù)： 274
中 圖 價(jià):¥33.3(3.4折) 定價(jià)  ¥98.0 登錄后可看到會(huì)員價(jià)
加入購(gòu)物車 收藏
運(yùn)費(fèi)6元，滿39元免運(yùn)費(fèi)
?新疆、西藏除外
溫馨提示：5折以下圖書主要為出版社尾貨，大部分為全新（有塑封/無塑封），個(gè)別圖書品相8-9成新、切口
有劃線標(biāo)記、光盤等附件不全詳細(xì)品相說明>>
本類五星書更多>
買過本商品的人還買了

集成電路封裝材料的表征 版權(quán)信息

集成電路封裝材料的表征 本書特色

　　《集成電路封裝材料的表征(英文)》的主要內(nèi)容包括： foreword；preface to the reissue of the materials characterization series xiii；preface to series xiv；preface to the reissue of integrated circuit packaging materials xv；preface xvi；contributors xix等。

集成電路封裝材料的表征 內(nèi)容簡(jiǎn)介

相關(guān)領(lǐng)域的教學(xué)、研究、技術(shù)人員以及研究生和高年級(jí)本科生參考書。

集成電路封裝材料的表征 目錄

foreword xi
preface to the reissue of the materials characterization series xiii
preface to series xiv
preface to the reissue of integrated circuit packaging materials xv
preface xvi
contributors xix
ic package reliability testing
mold compound adhesion and strength
mechanical stress in ic packages
moisture sensitmty and delamination
thermal management
electrical performance of ic packages
solderability of integrated circuits
hermeticity and joining in ceramic ic packages
advanced interconnect technology
appendix： technique summaries
展開全部

集成電路封裝材料的表征 作者簡(jiǎn)介

Thomas M. Moore and Robert G. McKennaForeword by Walter H. Schroen， TI FELLOWCharacterization of Integrated Circuit Packaging Materials deals with the systemsof materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniquesappropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technologicalproblems of IC packages. This book discusses issues which affect a varietyof package types， including plastic surface—mount packages， hermetic packages， and advanced designs such as flip—chip， chip—on—board， and multi—chipmodels.

商品評(píng)論(0條)
暫無評(píng)論……
書友推薦
編輯推薦
返回頂部
中圖網(wǎng)
在線客服