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先進(jìn)電子封裝技術(shù)與關(guān)鍵材料叢書--從LED到固態(tài)照明:原理、材料、封裝、表征及應(yīng)用(英文版)
先進(jìn)電子封裝技術(shù)與關(guān)鍵材料叢書--從LED到固態(tài)照明:原理、材料、封裝、表征及應(yīng)用(英文版)
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先進(jìn)電子封裝技術(shù)與關(guān)鍵材料叢書--從LED到固態(tài)照明:原理、材料、封裝、表征及應(yīng)用(英文版) 版權(quán)信息
- ISBN：9787122394484
- 條形碼：9787122394484 ; 978-7-122-39448-4
- 裝幀：一般膠版紙
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先進(jìn)電子封裝技術(shù)與關(guān)鍵材料叢書--從LED到固態(tài)照明:原理、材料、封裝、表征及應(yīng)用(英文版) 本書特色
固體照明其主要優(yōu)勢(shì)是節(jié)能、環(huán)境友好和長壽命，而LED（發(fā)光二極管）封裝是獲得這些優(yōu)點(diǎn)的主要保障技術(shù)。本書全面闡述上述照明技術(shù)，介紹LED特點(diǎn)。LED封裝中的關(guān)鍵技術(shù)如互連、發(fā)光磷粉沉積、包封等將會(huì)重點(diǎn)闡述，同時(shí)兼顧熱管理和可靠性的評(píng)估，以及光學(xué)設(shè)計(jì)、分析和特征。LED在通用固體照明和特殊照明中的應(yīng)用將會(huì)重點(diǎn)介紹。同時(shí)討論技術(shù)線路圖有關(guān)內(nèi)容。 本選題作者李世瑋教授是國際知名的電子封裝領(lǐng)域?qū)＜遥荌EEE電子元件封裝制造技術(shù)學(xué)會(huì)（CPMT Society）的全球總裁；英國物理學(xué)會(huì)、美國機(jī)械工程師學(xué)會(huì)（ASME）和IEEE的會(huì)士（Fellow）。已出版3本電子封裝領(lǐng)域的英文學(xué)術(shù)專著，在學(xué)術(shù)界及出版界均享有盛譽(yù)。 本書特點(diǎn)如下： 1. 涵蓋照明、色度學(xué)、光度學(xué)、發(fā)光二極管的基本原理； 2. 全面介紹了LED晶圓和芯片的制程、LED芯片封裝、LED晶圓級(jí)封裝、板級(jí)組裝與LED模組、光學(xué)與電學(xué)表征、熱管理、可靠性、以及封裝材料等相關(guān)內(nèi)容。 3. 重點(diǎn)闡述了LED封裝中的關(guān)鍵技術(shù)如互連、熒光粉沉積、塑封等。 4. LED在通用固體照明和特殊照明中的應(yīng)用 5. 還討論了技術(shù)線路圖有關(guān)內(nèi)容。 6. 讀者將會(huì)從書中的工藝過程及實(shí)驗(yàn)數(shù)據(jù)中獲益。 7. 本書中大量的技術(shù)內(nèi)容是作者的實(shí)踐成果和實(shí)驗(yàn)成果，具有很強(qiáng)的產(chǎn)業(yè)化實(shí)踐指導(dǎo)意義。讀者將會(huì)從書中的工藝過程及實(shí)驗(yàn)數(shù)據(jù)中獲益。
先進(jìn)電子封裝技術(shù)與關(guān)鍵材料叢書--從LED到固態(tài)照明:原理、材料、封裝、表征及應(yīng)用(英文版) 內(nèi)容簡(jiǎn)介
固體照明其主要優(yōu)勢(shì)是節(jié)能、環(huán)境友好和長壽命，而LED（發(fā)光二極管）封裝是獲得這些優(yōu)點(diǎn)的主要保障技術(shù)。本書不僅涵蓋照明、色度學(xué)、光度學(xué)、發(fā)光二極管的基本原理，同時(shí)全面介紹了LED 晶圓和芯片的制程、LED 芯片封裝、LED 晶圓級(jí)封裝、板級(jí)組裝與LED 模組、光學(xué)與電學(xué)表征、熱管理、可靠性以及封裝材料等相關(guān)內(nèi)容。尤其重點(diǎn)闡述了LED 封裝中的關(guān)鍵技術(shù)如互連、熒光粉沉積、塑封等，LED 在通用固體照明和特殊照明中的應(yīng)用也是本書的重點(diǎn)，還討論了技術(shù)線路圖有關(guān)內(nèi)容。本書中大量的技術(shù)內(nèi)容是作者的實(shí)踐成果和實(shí)驗(yàn)成果，具有很強(qiáng)的產(chǎn)業(yè)化實(shí)踐指導(dǎo)意義，讀者將會(huì)從書中的工藝過程及實(shí)驗(yàn)數(shù)據(jù)中獲益。 本書適合從事LED 設(shè)計(jì)、材料研發(fā)、封裝和組裝工藝、可靠性測(cè)試和應(yīng)用等的高校及科研院所的研究人員及工程師使用。
先進(jìn)電子封裝技術(shù)與關(guān)鍵材料叢書--從LED到固態(tài)照明:原理、材料、封裝、表征及應(yīng)用(英文版) 目錄
Preface ⅸ
About the Authors ⅹⅰ
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.2.1 PTH LED Component 17
2.2.2 SMD LED Component 18
2.3 Chip Mounting and Interconnection 20
2.3.1 Die Attach Adhesive 21
2.3.2 Soldering and Eutectic Bonding 24
2.3.3 Wire Bonding 31
2.3.4 Flip-Chips 34
2.4 Phosphor Coating and Dispensing Process 38
2.4.1 Dispersed Dispensing 39
2.4.2 Conformal Coating 41
2.4.3 Remote Phosphor 45
2.5 Encapsulation and Molding Process 48
2.5.1 Encapsulant Filling with Lens 48
2.5.2 Lens Molding 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies for Wafer Level Packaging 66
3.3.1 Photolithography 66
3.3.2 Wafer Etching 68
3.3.3 TSV Filling 73
3.3.4 Bond Pad Metallization 73
3.3.5 Wafer Level Phosphor Deposition Methods 76
3.3.6 Moldless Encapsulation 87
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.4.1 Reflective Layer Design 91
3.4.2 Cavity and Reflective Cup by Wet Etching 92
3.4.3 Copper-Filled TSVs for Vertical Interconnection and Heat Dissipation 95
3.5 Processes of LED Wafer Level Packaging 96
3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots 96
3.5.2 Case 2: LED WLP with a Cavity 99
3.5.3 Case 3: Applications of an LED WLP Panel 103
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.2.1 Metal Core Printed Circuit Board 112
4.2.2 Printed Circuit Board with Thermal Vias 119
4.2.3 Wave Soldering 124
4.2.4 Surface Mount Reflow 126
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.1.1 Basic Concepts of Radiometric and Photometric 145
5.1.2 Irradiance Measurement Calibration 155
5.1.3 Common Measurement Equipment 156
5.2 Power Supply and Efficiency 159
5.2.1 Electrical Characteristics of LED 159
5.2.2 Power Supply for LEDs 161
5.2.3 Power Efficiency 162
5.3 Consideration of LED Thermal Performance 163
5.3.1 Thermal Characterization Methods for LEDs 163
5.3.2 Thermal Management Methods 170
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.1.1 Reliability of Electronic Components or Systems 175
6.1.2 Common Failure Mechanisms and Reliability Tests 176
6.2 Failure Analysis and Life Assessment 181
6.2.1 Methodology for Failure Analysis 181
6.2.2 Weibull Analysis and Acceleration Model for Life Assessment 182
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.1.1 Development 189
7.1.2 Typical Structures 190
7.1.3 Challenges 191
7.1.4 Conclusion 194
7.2 Micro- and Mini-LED Display 194
7.2.1 Development 195
7.2.2 Typical Structures 200
7.2.3 Challenges 202
7.2.4 Conclusion 203
7.3 LED for Visible Light Communication 203
7.3.1 Development 204
7.3.2 Typical Applications 205
7.3.3 Challenges 206
7.3.4 Conclusion 208
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV LED 213
8.1.1 Structures 213
8.1.2 Applications 218
8.1.3 Challenges 222
8.1.4 Conclusion 224
8.2 Applications of IR-LEDs 225
8.2.1 Structures 226
8.2.2 Applications 227
8.2.3 Challenges 231
8.2.4 Conclusion 232
8.3 Future Outlook and Other Technology Trends 233
8.3.1 Better Light Sources 233
8.3.2 Interconnection 234
8.3.3 Interaction with Humans 234
8.3.4 Light on Demand 235
References 235
Index 243
About the Authors ⅹⅰ
1 LEDs for Solid-State Lighting 1
1.1 Introduction 1
1.2 Evolution of Light Sources and Lighting Systems 1
1.3 Historical Development of LEDs 6
1.4 Implementation of White Light Illumination with an LED 8
1.5 LEDs for General Lighting 10
References 12
2 Packaging of LED Chips 15
2.1 Introduction 15
2.2 Overall Packaging Process and LED Package Types 16
2.2.1 PTH LED Component 17
2.2.2 SMD LED Component 18
2.3 Chip Mounting and Interconnection 20
2.3.1 Die Attach Adhesive 21
2.3.2 Soldering and Eutectic Bonding 24
2.3.3 Wire Bonding 31
2.3.4 Flip-Chips 34
2.4 Phosphor Coating and Dispensing Process 38
2.4.1 Dispersed Dispensing 39
2.4.2 Conformal Coating 41
2.4.3 Remote Phosphor 45
2.5 Encapsulation and Molding Process 48
2.5.1 Encapsulant Filling with Lens 48
2.5.2 Lens Molding 48
2.6 Secondary Optics and Lens Design 50
References 54
3 Chip Scale and Wafer Level Packaging of LEDs 61
3.1 Introduction 61
3.2 Chip Scale Packaging 63
3.3 Enabling Technologies for Wafer Level Packaging 66
3.3.1 Photolithography 66
3.3.2 Wafer Etching 68
3.3.3 TSV Filling 73
3.3.4 Bond Pad Metallization 73
3.3.5 Wafer Level Phosphor Deposition Methods 76
3.3.6 Moldless Encapsulation 87
3.4 Designs and Structures of LED Wafer Level Packaging 91
3.4.1 Reflective Layer Design 91
3.4.2 Cavity and Reflective Cup by Wet Etching 92
3.4.3 Copper-Filled TSVs for Vertical Interconnection and Heat Dissipation 95
3.5 Processes of LED Wafer Level Packaging 96
3.5.1 Case 1: Multichip LED WLP with Through Silicon Slots 96
3.5.2 Case 2: LED WLP with a Cavity 99
3.5.3 Case 3: Applications of an LED WLP Panel 103
References 106
4 Board Level Assemblies and LED Modules 111
4.1 Introduction 111
4.2 Board Level Assembly Processes 112
4.2.1 Metal Core Printed Circuit Board 112
4.2.2 Printed Circuit Board with Thermal Vias 119
4.2.3 Wave Soldering 124
4.2.4 Surface Mount Reflow 126
4.3 Chip-on-Board Assemblies 130
4.4 LED Modules and Considerations 137
References 141
5 Optical, Electrical, and Thermal Performance 145
5.1 Evaluation of Optical Performance 145
5.1.1 Basic Concepts of Radiometric and Photometric 145
5.1.2 Irradiance Measurement Calibration 155
5.1.3 Common Measurement Equipment 156
5.2 Power Supply and Efficiency 159
5.2.1 Electrical Characteristics of LED 159
5.2.2 Power Supply for LEDs 161
5.2.3 Power Efficiency 162
5.3 Consideration of LED Thermal Performance 163
5.3.1 Thermal Characterization Methods for LEDs 163
5.3.2 Thermal Management Methods 170
References 172
6 Reliability Engineering for LED Packaging 175
6.1 Concept of Reliability and Test Methods 175
6.1.1 Reliability of Electronic Components or Systems 175
6.1.2 Common Failure Mechanisms and Reliability Tests 176
6.2 Failure Analysis and Life Assessment 181
6.2.1 Methodology for Failure Analysis 181
6.2.2 Weibull Analysis and Acceleration Model for Life Assessment 182
6.3 Design for Reliability 185
References 187
7 Emerging Applications of LEDs 189
7.1 LEDs for Automotive Lighting 189
7.1.1 Development 189
7.1.2 Typical Structures 190
7.1.3 Challenges 191
7.1.4 Conclusion 194
7.2 Micro- and Mini-LED Display 194
7.2.1 Development 195
7.2.2 Typical Structures 200
7.2.3 Challenges 202
7.2.4 Conclusion 203
7.3 LED for Visible Light Communication 203
7.3.1 Development 204
7.3.2 Typical Applications 205
7.3.3 Challenges 206
7.3.4 Conclusion 208
References 208
8 LEDs Beyond Visible Light 213
8.1 Applications of UV LED 213
8.1.1 Structures 213
8.1.2 Applications 218
8.1.3 Challenges 222
8.1.4 Conclusion 224
8.2 Applications of IR-LEDs 225
8.2.1 Structures 226
8.2.2 Applications 227
8.2.3 Challenges 231
8.2.4 Conclusion 232
8.3 Future Outlook and Other Technology Trends 233
8.3.1 Better Light Sources 233
8.3.2 Interconnection 234
8.3.3 Interaction with Humans 234
8.3.4 Light on Demand 235
References 235
Index 243
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先進(jìn)電子封裝技術(shù)與關(guān)鍵材料叢書--從LED到固態(tài)照明:原理、材料、封裝、表征及應(yīng)用(英文版) 作者簡(jiǎn)介
李世瑋，香港科技大學(xué)，IEEE電子元件封裝制造技術(shù)學(xué)會(huì)（CPMT Society）的全球總裁；英國物理學(xué)會(huì)、美國機(jī)械工程師學(xué)會(huì)（ASME）和IEEE評(píng)選為學(xué)會(huì)會(huì)士（Fellow），深圳研究院常務(wù)副院長、機(jī)械工程系教授、博士生導(dǎo)師，兼任先進(jìn)微系統(tǒng)封裝中心（CAMP）主任，李世瑋教授于1992年獲得美國普渡大學(xué)（Purdue University）航空航天工程博士學(xué)位，1993年加入香港科技大學(xué)（HKUST）任教，目前是香港科大深圳研究院常務(wù)副院長、機(jī)械工程系教授、博士生導(dǎo)師，兼任先進(jìn)微系統(tǒng)封裝中心（CAMP）主任，他也曾擔(dān)任過香港科大所屬的納米及先進(jìn)材料研發(fā)院（NAMI）的技術(shù)總監(jiān)，并于2010年被派任為佛山市香港科技大學(xué)LED-FPD工程技術(shù)研究開發(fā)中心的創(chuàng)建主任。李教授的研究領(lǐng)域覆蓋晶圓級(jí)和三維微系統(tǒng)封裝、硅通孔（TSV）和高密度互連、LED封裝和半導(dǎo)體照明技術(shù)、以及無鉛焊接工藝及焊點(diǎn)可靠性。他的團(tuán)隊(duì)在國際學(xué)術(shù)期刊及會(huì)議論文集上發(fā)表了兩百多篇技術(shù)論文，其中九篇獲得*佳論文獎(jiǎng)。李教授在各類學(xué)術(shù)活動(dòng)和國際會(huì)議上非常活躍，他曾擔(dān)任《IEEE電子元件及封裝技術(shù)期刊》的總主編，并兼任另外兩份國際學(xué)術(shù)期刊的編輯顧問。李教授還獲選為IEEE電子元件封裝制造技術(shù)學(xué)會(huì)（CPMT Society）的杰出講師，經(jīng)常受邀到全球各大學(xué)、研究單位、跨國公司、國際會(huì)議及論壇作專題報(bào)告或提供短期課程。由于李教授在國際間的成就及聲望，他于1999、2003和2008年分別被英國物理學(xué)會(huì)、美國機(jī)械工程師學(xué)會(huì)（ASME）和IEEE評(píng)選為學(xué)會(huì)會(huì)士（Fellow）。2012年初當(dāng)選為IEEE CPMT的全球總裁。
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