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先進聚酰亞胺材料:合成、表征及應用

先進聚酰亞胺材料:合成、表征及應用

出版社：化學工業(yè)出版社出版時間：2020-12-01
開本： 16開 頁數(shù)： 455
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先進聚酰亞胺材料:合成、表征及應用 版權(quán)信息

  • ISBN：9787122334985
  • 條形碼：9787122334985 ; 978-7-122-33498-5
  • 裝幀：簡裝本
  • 冊數(shù)：暫無
  • 重量：暫無
  • 所屬分類：>

先進聚酰亞胺材料:合成、表征及應用 本書特色

1.書稿由國家973聚酰亞胺材料首席科學家楊士勇教授主編，全部由國內(nèi)有關(guān)領(lǐng)域知名專家執(zhí)筆，內(nèi)容先進、原創(chuàng)。
□.本書匯總了我國聚酰亞胺973課題研究的原創(chuàng)成果，反映了聚酰亞胺這一先進材料在微電子領(lǐng)域、航空航天等領(lǐng)域的應用成果，在微電子領(lǐng)域，尤其是電子封裝領(lǐng)域具有較高的使用價值。

先進聚酰亞胺材料:合成、表征及應用 內(nèi)容簡介

先進聚酰亞胺材料，由于具有優(yōu)異的耐熱性、綜合力學性能、電學性能和化學穩(wěn)定性等，在航空、航天、微電子、平面顯示、電氣絕緣等高技術(shù)領(lǐng)域具有廣泛的應用前景。
本書系統(tǒng)介紹了先進聚酰亞胺材料的合成、性能和應用。包括先進聚酰亞胺薄膜、先進聚酰亞胺纖維、碳纖維復合材料用樹脂基體、超級工程塑料和泡沫材料、微電子用聚酰亞胺材料，還介紹了氣體分離膜、質(zhì)子交換膜、可溶性和低k 值聚酰亞胺材料。
本書可供化學工業(yè)、高分子材料、航空航天、微電子制造與封裝、平面顯示等領(lǐng)域的相關(guān)研究人員、工程師、研究生以及高年級的本科生參考使用。

先進聚酰亞胺材料:合成、表征及應用 目錄

Preface ix

List of Contributors xi

About the Editor xii

Chapter 1 Advanced Polyimide Films 1
Shi-Yong Yang and Li-Li Yuan
1.1 Introduction 1
1.□ Chemistry of Polyimide Films 3
1.□.1 Thermal Imidization 3
1.□.□ Chemical Imidization 8
1.3 Thermal Curing of Polyimide Films 14
1.3.1 Thermal Imidization Process 14
1.3.□ Influence of Curing Temperatures on Film’s Properties 18
1.4 Structures and Properties of Polyimide Films □0
1.4.1 Advanced Polyimide Films □0
1.4.□ Low-CTE Polyimide Films □8
1.4.3 Transparent Polyimide Films 37
1.4.4 Atomic Oxygen-resistant Polyimide Films 47
1.5 Surface Modification of Polyimide Films 5□
1.6 Applications of Polyimide Films 54
1.6.1 Electric Insulating Applications 54
1.6.□ Electronic and Optoelectronic Applications 56
1.6.3 Aerospace Applications 60
1.7 Summary 6□
REFERENCES 6□

Chapter □ Advanced Polyimide Fibers 67
Qing-Hua Zhang, Jie Dong and De-Zhen Wu
□.1 Introduction 67
□.□ Synthesis of Spinning Resin Solutions 68
□.□.1 “Two-Step” Polymerization Method 68
□.□.□ “One-Step” Polymerization Method 70
□.3 Preparation of Polyimide Fibers 7□
□.3.1 Wet-Spinning Method 7□
□.3.□ Dry-Spinning Method 77
□.3.3 Other-Spinning Methods 81
□.4 Structure and Properties of Polyimide Fibers 8□
□.4.1 Aggregation Structure of Polyimide Fibers 8□
□.4.□ Chemical Structure-Property Relationship 84
□.4.3 Properties of Polyimide Fibers 87
□.5 Applications of Polyimide Fibers 89
□.5.1 Production of Polyimide Fibers 89
□.5.□ Application of Polyimide Fibers 89
□.6 Summary 91
REFERENCES 91

Chapter 3 Polyimide Matrices for Carbon Fiber Composites 94
Shi-Yong Yang and Mian Ji
3.1 Introduction 94
3.□ NA-endcapped Thermoset Matrix Resins 95
3.□.1 Chemistry 96
3.□.□ Structures and Properties 97
3.3 PE-endcapped Oligoimide Resins 107
3.3.1 Chemistry 107
3.3.□ Structures and Properties 108
3.4 Properties of Polyimide/Carbon Fiber Composites 1□□
3.4.1 Preparation of PMR-type Resin Prepregs 1□□
3.4.□ Fabrication of Carbon Fiber Composites 1□□
3.4.3 Properties of NA-Endcapped Polyimide Composite□ □y Autoclave 1□3
3.4.4 Properties of PE-Endcapped Polyimide Composite□ □y Autoclave 1□7
3.4.5 Properties of PE-Endcapped Polyimide Composite□ □y RTM 130
3.5 Applications of Polyimide/Carbon Fiber Composites 13□
3.6 Summary 134
Contents
REFERENCES 134

Chapter 4 Super Engineering Plastics and Foams 137
Shi-Yong Yang, Hai-Xia Yang and Ai-Jun Hu
4.1 Introduction 137
4.□ Compression-Molded Polyimide Materials 138
4.3 Injection and Extrusion Processed Polyimide Materials 139
4.4 Structures and Melt Processabilities of Aromatic Polyimide Resins 145
4.4.1 Polyimide Backbone Structures 145
4.4.□ Controlled Molecular Weights 147
4.5 Meltable Thermoplastic Polyimide Composites 150
4.6 Reactive End-Capped Meltable Polyimide Resins 153
4.6.1 NA-end-capped Meltable Polyimide Resins 154
4.6.□ PE-end-capped Meltable Polyimide Resins 159
4.7 Heat-Resistant Polyimide Foams 16□
4.7.1 Introduction 16□
4.7.□ Opened-Cell Soft Polyimide Foams 163
4.7.3 Closed-Cell Rigid Polyimide Foams 169
4.8 Thermally Stable Flexible Polyimide Aerogels 178
4.9 Summary 185
REFERENCES 185

Chapter 5 Polyimides for Electronic Applications 189
Qing-Hua Lu and Feng Zheng
5.1 Introduction 189
5.□ Polyimide Materials for Microelectronics 190
5.□.1 Combined Property Requirements 190
5.□.□ Typical Applications 19□
5.□.3 Structures and Properties of Polyimide Materials for Microelectronics 195
5.3 Polyimide Materials for Optoelectric Planar Displays □06
5.3.1 Liquid Crystal Alignment Layers □06
5.3.□ Mechanical Rubbing Alignment Polyimides □07
5.3.3 Photoinduced Alignment PIs □08
5.3.4 The Microgroove Polyimide Surfaces □16
5.3.5 Langmuir–Blodgett Polyimide Films □17
5.4 Polyimide Materials for Optoelectronic Flexible Displays □17
5.4.1 Combined Property Requirements □17
5.4.□ Polyimides for Flexible Electronic Substrates □□1
5.5 Polyimide Materials for Electronic Memories □□6
5.5.1 Introduction □□6
5.5.□ Polyimides for Resistive-type Memory Devices □□9
5.5.3 Polyimides for Transistor-type Memory Devices □38
5.6 Summary □41
REFERENCES □4□

Chapter 6 Polyimide Gas Separation Membranes □53
Xiao-Hua Ma and Shi-Yong Yang
6.1 Introduction □53
6.□ Mechanisms of Gas Separation and Testing Methods □55
6.□.1 Gas Transport Mechanism □55
6.□.□ Apparatus for Testing Gas Transport Properties □59
6.3 Structures and Properties of Polyimide Membranes □60
6.3.1 Isomer Structure Effects From Diamines □60
6.3.□ Substitution and Geometric Effects From Diamines □61
6.3.3 Chemical Structure Effects of Dianhydrides □70
6.4 Intrinsically Microporous Polyimide Membranes □76
6.5 Hydroxyl-functionalized Polyimide and Its Derived Polybenzoxazole Membranes □87
6.5.1 Hydroxyl-functionalized Polyimide Membranes □87
6.5.□ Thermally Rearranged Polybenzoxazole (TR-PBO) Membranes □94
6.5.3 Applications of TR-PBO Contents Membranes 301
6.6 Polyimide-Derived Carbon Molecular Sieve Membranes 301
6.6.1 Formation of CMSMs 301
6.6.□ Conversion From Polyimide to CMSMs 30□
6.6.3 Structures and Properties of CMSMs 304
6.7 In Summary 314
REFERENCES 314

Chapter 7 Polyimide Proton Exchange Membranes 319
Jian-Hua Fang
7.1 Introduction 319
7.□ Monomer Synthesis 3□0
7.□.1 Synthesis of Sulfonated Diamines 3□0
7.□.□ Synthesis of Six-membered Ring Dianhydrides 3□9
7.3 Polyimide Preparations 330
7.3.1 Preparation From Sulfonated Diamines 330
7.3.□ Preparation From Sulfonated Dianhydrides 33□
7.3.3 Synthesis via Postsulfonation 333
7.3.4 Block Copolymerization 334
7.4 Ion Exchange Membrane Properties 338
7.4.1 Solubility 338
7.4.□ Thermal Stability 340
7.4.3 Water Uptake and Swelling Ratios 340
7.4.4 Proton Conductivity 34□
7.4.5 Water Resistance 344
7.4.6 Radical Oxidative Stability 356
7.4.7 Methanol Permeability 36□
7.5 Fuel Cell Performance 364
7.6 Summary 371
REFERENCES 371

Chapter 8 Soluble and Low-k Polyimide Materials 376
Yi Zhang and Wei Huang
8.1 Introduction 376
8.□ Structures and Properties of Soluble Aromatic Polyimides 377
8.□.1 Soluble Polyimides With Flexible Backbones 377
8.□.□ Soluble Polyimides With Asymmetric Structures 379
8.□.3 Soluble Polyimides With Alicyclic Structures 380
8.□.4 Soluble Polyimides With Side Groups 38□
8.3 Applications of Soluble Aromatic PIs 388
8.3.1 Second-order Nonlinear Optical (NLO) Materials 388
8.3.□ Memory Device Materials 39□
8.3.3 Compensator Materials for Liquid Crystal Displays 397
8.3.4 Gas Separation Materials 398
8.3.5 Other Applications 398
8.4 Low-k Polyimide Materials 399
8.4.1 Introduction 399
8.4.□ Impact Factors on Dielectric Properties 400
8.4.3 Structures and Dielectric Properties of Polyimides 403
8.4.4 Low-k Polyimides With Porous Structures 404
8.4.5 Organic-Inorganic Hybrid Polyimide Materials 4□1
8.4.6 Intrinsic Low-k Polyimide Materials 4□9
8.4.7 Summary 44□
REFERENCES 443

Appendix Unit of Measurement Conversion Table 453
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先進聚酰亞胺材料:合成、表征及應用 作者簡介

楊士勇，中國科學院化學研究所研究員、博士生導師、國家973項目首席科學家、1999年度國家杰出青年基金獲得者、中國科學院“百人計劃”資助獲得者、中國科學院大學教授、享受國務院政府特殊津貼的專家。
198□年畢業(yè)于蘭州大學化學系, 1985年在中國科學院化學研究所獲得碩士學位,1988年在南開大學獲得博士學位。1988-199□年在中國科學院上海有機化學研究所任助理研究員，199□-1996年先后在The University of New York at Buffalo 和The University of Chicago 從事博士后研究。1996年回國，在中國科學院化學研究所任副研究員、研究員。
近年來主要致力于對于國家經(jīng)濟建設(shè)和國防安全具有重要推動和促進作用的先進高分子材料的基礎(chǔ)和應用基礎(chǔ)研究。在碳纖維復合材料用耐高溫樹脂基體、耐高溫聚酰亞胺薄膜、耐高溫粘結(jié)劑、耐高溫工程塑料、微電子制造與封裝材料等方向取得了多項令人注目的研究成績。

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